ENGR SR, PACKAGE DEVELOPMENT_TL (NPI)
SWIR Vision Systems
Marketing & Communications, Product
Seremban, Negeri Sembilan, Malaysia
Posted on Sep 23, 2025
ENGR SR, PACKAGE DEVELOPMENT_TL (NPI)
Seremban, Negeri Sembilan, Malaysia
Job Description
onsemi is currently seeking a skilled and driven NPI Engineer – Soldering Process, Diebond and Wirebond to lead the introduction and optimization of soldering processes for new product lines in a high-tech manufacturing environment. This role is essential in ensuring robust process integration, high-yield production, and seamless transition from development to manufacturing. The position reports to the Director, New Product Engineering.
Responsibilities
- Leads the development and implementation of soldering, diebond and wirebond processes for new product introductions (NPI).
- Collaborate with R&D, Process Engineering, and Manufacturing teams to ensure soldering diebond and wirebond processes meet design and reliability requirements.
- Defines process parameters, control plans, and qualification strategies for soldering diebond and wirebondoperations.
- Conducts DFM (Design for Manufacturability) reviews with a focus on solder/ wire joint integrity and thermal profiles.
- Develops and executes process validation plans including DOE, capability studies, and reliability testing.
- Supports prototype builds and pilot runs, analyzing soldering diebond and wirebond performance and implementing improvements.
- Creates and maintains detailed documentation including work instructions, process flows, and FMEAs.
- Evaluates and qualifies soldering diebond and wirebond equipment, materials (e.g., solder paste, flux), and tooling.
- Implement automation and inspection technologies such as AOI, X-ray, and solder paste inspection (SPI).
- Drives root cause analysis and corrective actions for soldering-related defects and yield issues.
- Works closely with suppliers to evaluate and qualify soldering diebond and wirebond materials and equipment.
- Ensures compliance with IPC standards (e.g., IPC-A-610, J-STD-001) and customer requirements.
- Tracks and reports NPI metrics including yield, defect rates, and process stability.
Qualifications
Competencies:
The ideal candidate should demonstrate proficiency in:
- In-depth knowledge of soldering diebond and wirebond processes including reflow, wave, selective, and hand soldering.
- Experience with SMT assembly, solder paste printing, and thermal profiling.
- Familiarity with IPC standards and solder joint inspection criteria.
- Strong understanding of materials behavior under thermal and mechanical stress.
- Proficiency in statistical tools (SPC, DOE, FMEA) and data analysis.
- Excellent project management and cross-functional collaboration skills.
- Strong problem-solving and troubleshooting capabilities.
- Effective communication and documentation skills.
- Ability to manage multiple projects in a fast-paced environment.
Requirements:
- Bachelor’s or Master’s degree in Materials Science, Mechanical Engineering, Electronics Engineering, or related field.
- 3+ years of experience in NPI or process engineering with a focus on soldering in electronics or semiconductor manufacturing.
- Hands-on experience with soldering equipment, reflow ovens, and inspection systems.
- Proficiency in MS Office tools; advanced Excel skills required.
- Experience with MES systems; Wonderware experience is a plus.
- Familiarity with ISO and quality management systems.
About Us
onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
More details about our company benefits can be found here:
About the Team
| We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work. |
Job Info
- Job Identification 2503519
- Job Category Engineering
- Posting Date 09/10/2025, 03:49 AM
- Degree Level Bachelors
- Job Schedule Full time
- Locations Lot 122, Senawang Industrial Estate, Seremban, Negeri Sembilan, 70450, MY