We are looking for a skilled NPI Engineer to join our External Manufacturing team with a focus on wafer-level packaging (WLP) and post-foundry solutions. In this role, you will leverage your strong expertise and extensive technical network to develop new capability requirements, shape manufacturing strategies, and deliver advanced solutions for next-generation silicon technology and WLP solutions.

Responsibilities

Own backend external manufacturing NPI from conceptualization, development, qualification to production launch with a focus on wafer-level packaging (WLP) and post-fab solutions
Functional Leadership for NPI to deliver PLM requirements for new product commercialization and to co-work with cross functional team (comprising both internal and external stakeholders) to achieve on-time market release
Drive DFM, technology & manufacturability readiness for new product/ package development, effective POR freeze for new product introduction
Partner with OSATs to deliver assembly readiness for new product qualification. Key activities include BOM & process setup, risk analysis & mitigation, process characterization, lookahead assessment, qualification and CAB preparation leading to first part release
Manage production ramp: lead production safe launch, provide technical support to resolve ramp issues, develop CIP, set production baseline for transition into HVM
Collaborate with internal & external partners for technology pathfinding, package roadmap as well as design rules/ guideline development
Adoption of data analytics and data-driven approach to problem solving and decision making
Establish Best Known Methods (BKM) and Best-in-Class practices for new package platform and fan-out to production
Participate in quality and process readiness audit to achieve production site readiness
Co-work with operations to drive continuous yield improvement for evolving challenges
Subject Matter Expert to address arising package and assembly challenges
Experienced candidate(s) will be considered for lead role to manage team activities

Qualifications

Bachelor's Degree in Engineering/ Materials Science or equivalent technical background
More than 10 years of experience in backend semiconductor IC manufacturing environment, with in-depth assembly process expertise and shop floor experience
Hands-on experience in wafer-level packaging (WLP) and post-fab solutions including electroless & electrolytic plating and other surface finishing technology
Familiar with plating chemistry/ process and material/ metallurgy characterization & microstructural analysis
Prior experience in NPI, product/ process integration and familiar with Chip-to-Package Interaction (CPI) effect
Experience in IC package design/ CAD/ FEA simulation/ characterization will be advantageous
Good overall understanding of OSAT business landscape and operations
Adept at cross-functional collaboration, Adaptable to matrix organization, strong engineering fundamentals (including DOE characterization, SPC, failure analysis) and problem-solving skills
Strong project management skills and multi-stakeholder management
Proficient in statistical analysis methods and familiar with data analytics

Required Skills

New Product Development

About Us

onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.

More details about our company benefits can be found here:

https://www.onsemi.com/careers/career-benefits

About the Team

We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work.

Job Info

Job Identification 2503515
Job Category Engineering
Posting Date 10/10/2025, 03:59 AM
Degree Level Bachelors
Job Schedule Full time
Job Shift Day
Locations 2F.-1, No.1, Taiyuan 2nd St., Zhubei, 302082, TW 1 Sutong Rd., Suzhou, Jiangsu, 215021, CN

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