PRINCIPAL PACKAGE DEVELOPMENT ENGINEER
SWIR Vision Systems
Marketing & Communications, Product
Lapu-Lapu City, Cebu, Philippines
Posted on Dec 12, 2025
Job Title: Package Development Engineer
Reporting relationship: Directly reports to the Central Engineering Director, Cebu Phils.
onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
More details about our company benefits can be found here:
| We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work. |
QUALIFICATION:
- Strong background and hands-on experience in power discrete packaging technologies, including Si, SiC, and GaN.
- Proven leadership skills and ability to work effectively in a team environment.
- Excellent analytical and problem-solving abilities, with proficiency in project management, documentation, and reporting.
- Demonstrated innovation mindset and active involvement in research and development initiatives.
- Adaptability and willingness to learn new packaging development systems and processes.
- Exceptional written and verbal communication skills, with the ability to present complex technical information clearly.
- Bachelor’s or Master’s degree in Electrical Engineering, Materials Science, or a related discipline.
RESPONSIBILITIES:
- Provide technical leadership in new package and product development initiatives, ensuring innovation and alignment with organizational goals.
- Lead design and development of packaging and process solutions for advanced semiconductor devices, including Si, SiC, JFET, and GaN technologies.
- Research and select materials to optimize packaging performance and reliability, in collaboration with the Central Material Development (CMD) team.
- Collaborate and coordinate with cross-functional teams and manage stakeholders to drive successful execution of new package and product development projects.