Advanced Package Designer
SWIR Vision Systems
Marketing & Communications, Product, Design
Taiwan · Carmona, Cavite, Philippines
Posted on Jan 13, 2026
We are seeking an Advanced Packaging Designer to join our design team. This role will focus on designing, verifying, and documenting innovative IC packaging solutions to meet electrical, mechanical, and thermal requirements while ensuring compliance with industry standards (JEDEC, IPC, ISO) and internal specifications. The designer will collaborate with cross-functional teams to deliver manufacturable, reliable, and audit-ready package designs.
onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
More details about our company benefits can be found here:
| We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work. |
REQUIRED
- Bachelor’s degree in Electrical Engineering, Materials Science, Mechanical Engineering, or related field.
- Minimum of 3 years of experience in IC packaging design (substrate, wirebond, flip-chip, or alternative advanced packaging).
- Proficiency in EDA and CAD tools.
- Strong knowledge of semiconductor packaging technologies and materials.
- Demonstrated ability to recognize and document design risks that may impact thermal and reliability performance.
- Experience preparing manufacturing and compliance documentation.
- Excellent communication skills with ability to present technical data clearly.
PREFERRED
- Familiarity with IC/package/PCB co-design and signal integrity analysis.
- Proficient in APD+ and Solidworks or equivalent.
- Experience with package design and manufacturing workflows and documentation standards.
- Strong analytical skills for benchmarking and troubleshooting design requirements.
- Develop IC package designs that include a combination of substrate, lead frame, wirebond, flip-chip, wafer-level and other advanced packaging technologies.
- Apply fabrication, assembly and test constraints in designs.
- Generate detailed drawings, 3D models, and documentation for manufacturing and audits.
- Work closely with package design engineers, test engineers, and manufacturing teams.
- Present technical data in actionable, traceable formats for audits and stakeholders.
- Partner with supply chain and quality teams to ensure scalability and reliability.
- Contribute to design workflow automation and standards-driven documentation.
- Support continuous improvement initiatives in packaging design and compliance.
- Ensure packaging designs align with JEDEC, IPC, ISO, and internal design rules.
- Capture requirements into traceable, automation-friendly formats for compliance checklists.
- Benchmark internal packaging specs against industry standards and identify mismatches.