NPI Engineer - Die Saw
SWIR Vision Systems
Lapu-Lapu City, Cebu, Philippines
Posted on Jan 29, 2026
Handles product qualification (NPI/NPD, fab transfer, In-sourcing, others as deemed necessary) and safe launch lots at die fab processes (die bank, wafer mount, wafer grind, wafer saw, AOI).
onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
More details about our company benefits can be found here:
| We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work. |
- Engineering graduate or Material Science or Physics Graduate or Equivalent.
- Experience in semiconductor assembly manufacturing for at least 3 years with specific experience on wafer saw process.
- Skilled in data analysis using Minitab and other software that will aid process performance assessment.
- Knowledgeable on 8D, FMEA, Control Plan, DOE & Risk Management and Mitigation.
- Team player and result-driven.
- Critical thinker.
- Good presentation skills.
- Provide process support for die bank, wafer mount, wafer grinding, wafer saw and automated inspection for NPI projects and safe launches working closely with the technical leader.
- Generate qualification plan for NPI projects from die bank to automated inspection (as appliable) based on risk analysis defining the critical input variable and output responses referencing the characterization spec.
- Generate qualification reports based on qualification plan per deliverables defined for the project.
- Create wafer saw and AOI/Camtech recipes as necessary in collaboration with sustaining PE.
- Lead the investigation on issues related to die fab processes for NPI projects in collaboration with the technical leader to identify rootcause and generate improvement plans.
- Handles documentation related to the process/es of assignment.
- Handles other responsibility as deemed necessary by the supervisor.
- Qualify low-cost materials and tools.