New Product Engineering Technical Leader - Power Discrete
SWIR Vision Systems
Product, IT
Shanghai, China · Suzhou, Jiangsu, China
Posted on Feb 4, 2026
We are searching for a New Product Engineering Technical Leader to drive all product-level engineering activities for Si, SiC, and GaN discrete devices in automotive and industrial applications at onsemi. This is a high-priority business growth area for the division, and we invite you to join us in this exciting career opportunity.
onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
More details about our company benefits can be found here:
| We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work. |
Requirements:
- Master’s degree in Electrical/Electronics or Materials Science.
- 10 years of semiconductor discrete power device development (Si, SiC, GaN).
- Strong knowledge of device physics, packaging, and reliability for discrete products.
- Leadership capability to influence and lead teams across functional organizations.
- Excellent communication skills to represent engineering activities to executive leadership.
The successful candidate will combine strong technical expertise with leadership and communication skills to act as the engineering owner for discrete products, ensuring alignment between technical execution and business objectives. This individual will collaborate with global new product development teams and cross-functional organizations to define, prioritize, and drive product-level engineering activities, making decisions that achieve performance, reliability, cost, and schedule targets.
1. Own Product-Level Engineering Decisions
- Define and maintain the Product Technical Requirements Document (PTRD/PTS) for Si/SiC/GaN discrete devices.
- Identify and evaluate candidate process technologies for feasibility and risk.
- Develop system-level models to validate product architecture and performance.
- Estimate die size, CLC, and total manufacturing cost for business case alignment.
- Create and maintain a preliminary risk register with mitigation strategies.
2. Lead Cross-Functional Design Execution
- Drive creation of Functional Interface Tool (FIT) for new die.
- Oversee package electrical and mechanical modeling for discrete packages.
- Validate product-level performance through 3D modeling and simulation.
- Coordinate design FMEA and implement Best Known Methods (BKMs).
- Facilitate product design reviews and acceptance gates.
- Develop and approve product design validation plans.
- Ensure achievement of process and product design freeze milestones.
- Provide design rules and resolve technical issues for product qualification and release.
3. Align Engineering Schedule and Deliverables
- Collaborate with Technology Development (TD) to define Look-Ahead Reliability plans.
- Ensure deliverables across functions are linked, realistic, and prioritized.
- Define cycle times for key deliverables and monitor progress.
- Identify critical risks and drive mitigation plans proactively.
4. Support Business Case Development
- Provide accurate engineering inputs for cost modeling:
- Die cost, package cost, and total product cost.
- Tooling expenses and CAPEX requirements.
- Target yields and associated risk factors.
5. Drive Engineering Execution and Decision-Making
- Lead daily execution across die design, packaging, product/test, application, reliability, and manufacturing industrialization.
- Chair weekly project team meetings to prioritize issues and make timely decisions.
- Act as the single point of accountability for engineering deliverables.
6. Ensure Smooth Handoff to Manufacturing
- Support transition from development to high-volume manufacturing post product release.
Validate readiness of processes, documentation, and quality standards