Principal Product Engineer - High Power Module
SWIR Vision Systems
Product
Seremban, Negeri Sembilan, Malaysia
Posted on Feb 4, 2026
Lead product engineering activities for Advanced Power Modules in the New Product Development (NPD) division. This role focuses on developing next-generation power modules using advanced embedded packaging technologies, such as chip embedding and interposer-based integration, to achieve high performance and reliability. You will ensure manufacturability, quality, and robustness through prototype builds, qualification runs, and validation processes, collaborating with global cross-functional teams to deliver automotive-grade solutions.
onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
More details about our company benefits can be found here:
| We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work. |
- Bachelor’s degree in engineering (advanced degree preferred).
- 10+ years in semiconductor product engineering with strong experience in power module development.
- Proven expertise in power semiconductor technologies.
- Familiarity with advanced embedded packaging technologies (e.g., chip embedding, interposer-based integration).
- Strong skills in SPC, DOE, and data-driven problem solving.
- Excellent communication and collaboration skills for global team environments.
- Highly organized, self-motivated, and passionate about continuous improvement.
- Prototype & Qualification Builds
- Plan and execute prototype and qualification runs for embedded power modules, ensuring compliance with NPD phase-gate requirements.
- Validate build integrity and maintain accurate documentation of process parameters and outcomes.
- Advanced Embedded Packaging
- Apply expertise in chip embedding, interposer integration, and thermal/electrical optimization for module development.
- Perform process characterization and data analysis to optimize yield, reliability, and performance.
- Failure Analysis & Issue Resolution
- Conduct root-cause analysis for product issues and collaborate with design, process, and reliability teams to implement corrective actions.
- Document lessons learned and integrate improvements into future builds.
- Cross-Functional Collaboration
- Work closely with design, technology development, and manufacturing teams to ensure smooth transition from development to production.
- Communicate status, risks, and mitigation plans proactively to global stakeholders.
- Compliance & Release
- Confirm qualification evidence meets internal standards before product release.
- Support audits and maintain traceability of product engineering deliverables.