Sr Wire Bond NPI Engineer
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Lapu-Lapu City, Cebu, Philippines
Posted on Feb 7, 2026
Job Summary:
onsemi is currently seeking an experienced Process Engineer to work on product qualification (NPI/NPD, fab transfer, In-sourcing, others as deemed necessary) and safe launch lots for ultrasonic wirebond and IVI processes for all the product groups. Lead investigation on issues / EFAR cases related to ultrasonic wire bonding process under NPI category and lead WB technology and material roadmap.
Competencies
- Leading WB Set-up fo New Product Introductions
- Knowledge on Orthodyne and KNS/Power fusion wirebond platforms with deep understanding on the parameters, materials and tools.
- Establishing process windows using DOE and pareto analysis
- Ability to improve Cpk/Cp and DPMO for WB parameters
- Root‑cause analysis of bond lifts, non‑sticks, wire breaks, cratering
- Correlation of WB defects to substrate, leadframe, die, and mold compound interactions.
- Driving safe‑launch strategies and containment plans
- Coordinating WB readiness during ramp‑up phases
onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
More details about our company benefits can be found here:
| We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work. |
- Engineering graduate or Material Science or Physics Graduate or Equivalent.
- Experience in semiconductor assembly manufacturing for at least 5 years with specific experience in ultrasonic wire bonding process or related process.
- Skilled in data analysis using Minitab and other software that will aid process performance assessment.
- Knowledgeable on 8D, FMEA, Control Plan, DOE & Risk Management and Mitigation.
- Understand Orthodyne and KNS wirebond platforms.
- Team player and result driven.
- Critical thinker.
- Good presentation skills.
- Provide process support for ultrasonic wirebond process and IVI (as applicable) working closely with the technical leader.
- Generate qualification plan for NPI projects at wirebond based on risk analysis defining the critical input variable and output responses referencing the characterization spec.
- Generate qualification reports based on qualification plan per deliverables defined for the project.
- Create wirebond and/or IVI recipes in collaboration with sustaining PE and/or CE.
- Lead the investigation on issues related to wirebond for NPI projects in collaboration with the technical leader to identify rootcause and provide improvement plans.
- Handles documentation related to the process/es of assignment.
- Handles other responsibility as deemed necessary by the supervisor.
This job is no longer accepting applications
See open jobs at SWIR Vision Systems.See open jobs similar to "Sr Wire Bond NPI Engineer" Oval Park.