Sr Wire Bond NPI Engineer
SWIR Vision Systems
Lapu-Lapu City, Cebu, Philippines
Posted on Feb 7, 2026
Job Summary:
onsemi is currently seeking an experienced Process Engineer to work on product qualification (NPI/NPD, fab transfer, In-sourcing, others as deemed necessary) and safe launch lots for ultrasonic wirebond and IVI processes for all the product groups. Lead investigation on issues / EFAR cases related to ultrasonic wire bonding process under NPI category and lead WB technology and material roadmap.
Competencies
- Leading WB Set-up fo New Product Introductions
- Knowledge on Orthodyne and KNS/Power fusion wirebond platforms with deep understanding on the parameters, materials and tools.
- Establishing process windows using DOE and pareto analysis
- Ability to improve Cpk/Cp and DPMO for WB parameters
- Root‑cause analysis of bond lifts, non‑sticks, wire breaks, cratering
- Correlation of WB defects to substrate, leadframe, die, and mold compound interactions.
- Driving safe‑launch strategies and containment plans
- Coordinating WB readiness during ramp‑up phases
onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
More details about our company benefits can be found here:
| We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work. |
- Engineering graduate or Material Science or Physics Graduate or Equivalent.
- Experience in semiconductor assembly manufacturing for at least 5 years with specific experience in ultrasonic wire bonding process or related process.
- Skilled in data analysis using Minitab and other software that will aid process performance assessment.
- Knowledgeable on 8D, FMEA, Control Plan, DOE & Risk Management and Mitigation.
- Understand Orthodyne and KNS wirebond platforms.
- Team player and result driven.
- Critical thinker.
- Good presentation skills.
- Provide process support for ultrasonic wirebond process and IVI (as applicable) working closely with the technical leader.
- Generate qualification plan for NPI projects at wirebond based on risk analysis defining the critical input variable and output responses referencing the characterization spec.
- Generate qualification reports based on qualification plan per deliverables defined for the project.
- Create wirebond and/or IVI recipes in collaboration with sustaining PE and/or CE.
- Lead the investigation on issues related to wirebond for NPI projects in collaboration with the technical leader to identify rootcause and provide improvement plans.
- Handles documentation related to the process/es of assignment.
- Handles other responsibility as deemed necessary by the supervisor.