Senior Assembly Process Engineer (Wirebond)
SWIR Vision Systems
San Miguel, Manila, Metro Manila, Philippines
Posted on Mar 10, 2026
A Senior Wire Bond Process Engineer optimizes, sustains, and develops ultrasonic wire bonding processes to enhance yield, quality, and cost-efficiency in semiconductor manufacturing. Key duties include managing New Product Introductions (NPI), conducting DoE (Design of Experiments) for process optimization, troubleshooting defects (bond lifts, wire breaks), and mentoring junior staff.
onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
More details about our company benefits can be found here:
| We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work. |
- Education: Bachelor’s or Master’s degree in Engineering (Mechanical, Electrical, Electronics, or Semiconductor Technology).
- Experience: Typically 5+ years of experience in semiconductor backend manufacturing, specifically in wire bonding.
- Technical Skills: Deep understanding of ultrasonic wire bonding techniques, materials (Au, Cu, Al wires), and equipment, along with strong data analysis skills (e.g., Pareto analysis, SPC).
- Soft Skills: Strong problem-solving, collaboration, and communication skills to work with cross-functional teams.
onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a continued focus on the automotive and industrial end-markets, onsemi is accelerating change and driving disruptive innovation towards a sustainable ecosystem in high-growth megatrends such as vehicle electrification, advanced safety, alternative energy, and factory automation. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world. Today, the industrial and automotive end-markets are responsible for two-thirds of global greenhouse gas emissions, providing an immense opportunity for onsemi to do its part in achieving a net-zero economy with its intelligent power and sensing technologies. Climate change presents not only a risk to the environment, but also opportunities for innovative business solutions, and onsemi is committed to applying its research and design expertise and adapting its own operations to achieve net-zero emissions by 2040.
- Process Optimization & Development: Define, develop, and document wire bonding recipes and parameters (parameters, tools, materials) for new and existing products.
- Yield & Quality Improvement: Analyze yield trends, implement root-cause analyses for failures (e.g., bond lifts, cratering), and drive corrective actions (PDCA) to improve Cpk/Cp and reduce DPMO.
- NPI & Qualification: Coordinate the setup, validation, and qualification of new wire bonding equipment and materials, including material characterization.
- Troubleshooting & Support: Provide technical, hands-on support to production teams, including troubleshooting wire bonders (e.g., K&S, ASM, Shinkawa, Orthodyne platforms).
- Documentation & Compliance: Create and update process specifications, Standard Operating Procedures (SOPs), FMEA, and Control Plans to meet ISO/IATF 16949 standards.
- Mentorship: Coach junior engineers and technicians on technical skills and best practices.