Failure Analysis Engineer
SWIR Vision Systems
Carmona, Cavite, Philippines
Posted on Mar 12, 2026
The position requires the individual to perform full failure analysis until failure mechanism identification on internal and external customer returns.
Participate and execute on projects and tasks assigned by respective team leader / manager
onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
More details about our company benefits can be found here:
| We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work. |
Education
BS Degree in ECE, EE, Computer Engineering, or equivalent degree in Semiconductor Physics and Electronics with solid background on electronic schematic analysis;
Experience
Working experience on failure analysis, product analysis, product design, or equivalent is an advantage;
Skills
Good understanding of semiconductor physics related to transistors and equivalent;
Should be able to understand device specifications and interpret schematics
Good communication and interpersonal skills. Will be creating reports and interact with customers and counterparts;
Can work as an individual with minimum supervision or together with a team to complete assigned tasks;
Knowledge of semiconductor failure mechanisms and FA tools will be an advantage;
Knowledge of Image Sensor devices will be an advantage.
* Understanding semiconductor device specifications;
* Knowledge of bench test tools and setup up to verify device failure mode;
* Use failure isolation techniques such as Emission Microscopy, OBIRCH to determine failure mechanism;
* Chemical handling will be necessary for chemical decapsulation procedures (acids and bases);
* Mechanical microprobing at die-level for nodal analysis;
* Good understanding of device schematics (transistor level);
* Report generation to be submitted to internal and external customers, and from time to time interact with external customers and counterparts.