ATE Board Repair Technicians
SWIR Vision Systems
Lapu-Lapu City, Cebu, Philippines
Posted on Mar 25, 2026
Hands-on technician role performing board-level diagnostics, rework, repair, and verification on PCBs, load boards, interface cards, and modules supporting semiconductor test and manufacturing. Scope includes fault isolation, component-level replacement (SMD/BGA/QFN/through-hole), micro-soldering, reflow profiling, X-ray verification, and conformal coating/cleaning. Partners with Test Engineering, FA/Quality, and Production to restore functionality quickly and prevent repeats.
onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
More details about our company benefits can be found here:
| We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work. |
- Diploma/Associate’s in ECE/EE/Mechatronics (or equiv. experience); 2+ years board-level repair in electronics manufacturing/service (preferably test hardware/PCBA).
- Proficiency with soldering stations, hot air, BGA rework systems, microscopes, and metrology.
- Strong ESD, MSL, and safe handling of lead-free and chemicals (flux/cleaners).
- Able to read schematics, BOMs, ECAD outputs (Gerbers, netlists).
- Triage incoming boards; document failure symptoms, history, and disposition in CMMS/repair tracker.
- Perform component-level fault isolation using schematics, netlists, continuity, and signal tracing.
- Execute soldering/rework: BGA, QFN, LGA, fine-pitch, through-hole; micro-soldering under microscope.
- Set & verify reflow profiles; manage BGA reballing; validate with X-ray/AOI as needed.
- Use DMM, oscilloscope, LCR, bench power, hot air, preheater, rework station, microscope.
- Inspect & clean assemblies; manage flux/cleaners; re-apply conformal coating per spec.
- Handle ESD controls, correct moisture sensitivity (MSL/bake), LOTO on powered jigs/fixtures.
- Update ECO notes, work instructions (WIs), and repair records; ensure full traceability.
- Collaborate on design-for-repairability feedback; highlight weak points (pads, vias, thermals).
- Support load-board/contact hardware care (socket/lid threads, pins, receptacles, pogo pins).