External Manufacturing NPI Engineer (Assembly Packaging)
SWIR Vision Systems
Suzhou, Jiangsu, China
Posted on Apr 7, 2026
We are looking for a skilled NPI Engineer (Assembly Packaging) to join our External Manufacturing team to drive our growing NPI/ NPD portfolio in China, especially new tactical engagements critical for onsemi's business growth. Key focus will be wafer-level packaging (WLP), bumping and post-foundry solutions. In this role, you will leverage your strong expertise and extensive technical network to drive new production introduction, develop new capability requirements, shape manufacturing strategies, and deliver advanced solutions for next-generation silicon technology and WLP solutions.
onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
More details about our company benefits can be found here:
| We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work. |
- Bachelor's Degree in Engineering/ Materials Science or equivalent technical background
- More than 10 years of experience in backend semiconductor IC manufacturing environment, with in-depth assembly process expertise and shop floor experience
- Hands-on experience in wafer-level packaging (WLP), bumping and post-fab solutions including electroless & electrolytic plating and other surface finishing technology
- Familiar with plating chemistry/ process and material/ metallurgy characterization & microstructural analysis
- Exposure to power device technologies (SiC, JFET, GaN, IGBT, Hybrid etc)
- Prior experience in NPI, product/ process integration and familiar with Chip-to-Package Interaction (CPI) effect
- Experience in IC package design/ CAD/ FEA simulation/ characterization will be advantageous
- Good overall understanding of OSAT business landscape and operations
- Adept at cross-functional collaboration, Adaptable to matrix organization, strong engineering fundamentals (including DOE characterization, SPC, failure analysis) and problem-solving skills
- Strong project management skills and multi-stakeholder management
- Proficient in statistical analysis methods and familiar with data analytics
- Good communication skills and proficient in written & spoken English. Spoken proficiency in Mandarin will be advantageous
- Own backend external manufacturing NPI from conceptualization, development, qualification to production launch with a focus on wafer-level packaging (WLP) and post-fab solutions
- Functional Leadership for NPI to deliver PLM requirements for new product commercialization and to co-work with cross functional team (comprising both internal and external stakeholders) to achieve on-time market release
- Drive DFM, technology & manufacturability readiness for new product/ package development, effective POR freeze for new product introduction
- Partner with OSATs to deliver assembly readiness for new product qualification. Key activities include BOM & process setup, risk analysis & mitigation, process characterization, lookahead assessment, qualification and CAB preparation leading to first part release
- Manage production ramp: lead production safe launch, provide technical support to resolve ramp issues, develop CIP, set production baseline for transition into HVM
- Collaborate with internal & external partners for technology pathfinding, package roadmap as well as design rules/ guideline development
- Adoption of data analytics and data-driven approach to problem solving and decision making
- Establish Best Known Methods (BKM) and Best-in-Class practices for new package platform and fan-out to production
- Participate in quality and process readiness audit to achieve production site readiness
- Co-work with operations to drive continuous yield improvement for evolving challenges
- Subject Matter Expert to address arising package and assembly challenges
- Experienced candidate(s) will be considered for technical lead role to manage team activities