The Director of Probe & Post‑Fab Operations is responsible for end‑to‑end leadership of wafer manufacturing activities from electrical probe through post‑fab processing, including wafer thinning and back side metallization. This role owns the transition from electrical qualification to wafer readiness for assembly, with accountability for yield, cost per wafer, wafer integrity, reliability, cycle time, and operational scalability.
A key responsibility of this role is to define and execute the automation strategy for Post‑Fab Operations, ensuring that post‑fab manufacturing systems, controls, and data integration resemble front‑end fab standards, while supporting a phased approach to material handling automation (onsemi assembly test operations and external assembly)
onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work.
onsemi is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, ethnicity, color, religion, ancestry, national origin, age, marital status, pregnancy, sex, sexual orientation, physical or mental disability, medical condition, genetic information, military or veteran status, gender identity, gender expression, or any other protected category under applicable federal, state, or local laws.
If you are an individual with a disability and require a reasonable accommodation to complete any part of the application process, or are limited in the ability or unable to access or use this online application process and need an alternative method for applying, you may contact
Talent.acquisition@onsemi.com for assistance.
Required
- Bachelor’s degree in engineering or related technical discipline
- 12+ years of semiconductor manufacturing experience
- Demonstrated leadership in Probe and/or Post‑Fab Operations
- Experience driving manufacturing system standardization and/or automation
- Proven ability to lead organizations through operational change
Preferred
- Advanced degree (MS or PhD)
- Experience leading multi‑area manufacturing organizations
- Thin‑wafer, power, or analog device manufacturing background
- Experience deploying MES, tracking, or automation in non‑fab environments
Salary: onsemi is excited to share the base salary range for this position is $164,800 to $296,600 exclusive of fringe benefits or potential bonuses. The final pay rate for the successful candidate will depend on geographic location, skills, education, experience, and/or consideration of the internal equity of our current team members. We also offer a competitive benefits package. https://www.onsemi.com/site/pdf/Benefits-Summary-USA.pdf
Leadership & Strategy
- Define and execute the operational, technical, and automation strategy for Probe & Post‑Fab Operations
- Establish a phased automation roadmap for Post‑Fab, balancing near‑term practicality with long‑term scalability
- Ensure Post‑Fab systems and execution models align with fab‑level manufacturing standards
Operational Ownership
- Full accountability for yield, cost per wafer, cycle time, and quality from probe through post‑fab
- Lead stable execution of post‑fab operations during automation transitions
- Drive continuous improvement while maintaining production continuity
Automation & Manufacturing Systems
- Lead the evolution of Post‑Fab Operations toward a fab‑like operating model, including:
- MES usage, tracking, and lot genealogy
- SPC, recipe control, and data integrity
- Standard work and operational discipline
- Establish an automation approach where:
- Short‑term: tool‑to‑tool transport may remain manual
- Long‑term: material delivery and flow enable automated solutions
- Partner with IT, Manufacturing Systems, and Facilities to ensure scalable, standardized implementation
Technical Stewardship
- Provide oversight of:
- Probe strategies and probe card utilization
- Wafer thickness targets, TTV, warp, and bow controls
- Back side metallization robustness and compatibility with assembly flows
- Ensure manufacturing readiness for new products and volume ramps
Organization & Talent
- Build, develop, and retain high‑performing engineering and operations teams
- Establish clear expectations for managers and technical leaders
- Promote a culture of discipline, accountability, and continuous improvement
Cross‑Functional Integration
- Serve as the primary interface to:
- Front‑end Fab leadership
- Assembly and packaging organizations
- Quality, reliability, supply chain, and IT teams
- Support capital planning, automation investments, and cost‑reduction initiatives