Semiconductor Packaging Modeling and Simulation Engineer
SWIR Vision Systems
San Jose, CA, USA · Scottsdale, AZ, USA
USD 146,970-249,780 / year
Posted on May 5, 2026
onsemi is seeking a self-driven and motivated professional to join their Corporate R & D modeling and simulation team, located in (Phoenix AZ or San Jose, CA). As a semiconductor packaging modeling and simulation engineer, you will have the opportunities to support new power module development and new product design, assembly and process, quality and reliability, and customers in worldwide.
onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
More details about our company benefits can be found here:
We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work.
onsemi is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, ethnicity, color, religion, ancestry, national origin, age, marital status, pregnancy, sex, sexual orientation, physical or mental disability, medical condition, genetic information, military or veteran status, gender identity, gender expression, or any other protected category under applicable federal, state, or local laws.
If you are an individual with a disability and require a reasonable accommodation to complete any part of the application process, or are limited in the ability or unable to access or use this online application process and need an alternative method for applying, you may contact Talent.acquisition@onsemi.com for assistance.
• Master or PhD degree in Physics, Mechanical Engineering, Computational Mechanics, Solid Mechanics or Materials
• Knowledge and experience on thermal, mech modeling as well as crystal plasticity, and Cu/Ag sintering process
• Knowledge and experience of CAD concepts and Solidworks
• Familiar with semiconductor packaging
• Familiar with material thermal mech properties
• Strong knowledge of problem analysis and diagnosis technique
• Deep knowledge of non-linear solid mechanics, fracture mechanics and delamination
• Familiar with package test and analysis, quality assurance, and reliability methods
• Ability to perform model correlation to empirical measurement
• Familiar with the Unix/Linux operating system
• Familiar with FEA software ANSYS Mechanical APDL/Work Bench
• Strong English communication capability
• Strong learning capability
• Good team player
onsemi (Nasdaq: ON) is driving energy efficient innovations, empowering customers to reduce global energy use. The company is a leading supplier of semiconductor-based solutions, offering a comprehensive portfolio of energy efficient power and signal management, logic, standard and custom devices. The company’s products help engineers solve their unique design challenges in automotive, communications, computing, consumer, industrial, medical and military/aerospace applications. ON Semiconductor operates a responsive, reliable, world-class supply chain and quality program, and a network of manufacturing facilities, sales offices and design centers in key markets throughout North America, Europe and the Asia Pacific regions.
onsemi is excited to share the base salary range for this position is $146,970 to $249,780 Range exclusive of fringe benefits or potential bonuses. The final pay rate for the successful candidate will depend on geographic location, skills, education, experience, and/or consideration of internal equity of our current team members. We also offer a competitive benefits package. https://www.onsemi.com/site/pdf/Benefits-Summary-USA.pdf
The successful candidate will have the opportunity to:
• Do thermal-mech simulation for microelectronic packaging and system, assembly process
such as Ag sintering and Cu sintering
• Analyze existing packages of reliability issues that are induced by thermal problems.
• Do analysis and correlation of thermal mech modeling results to measured data
• Develop and maintain the state of art thermal mech modeling methodology to improve the modeling work efficiency and accuracy
• Setup and maintain the HW/SW environment for thermal modeling
• Provide support to other thermal mech modeling users in the company
• Innovation of new technology through simulation
• Develop the state of art simulation methodology such as Digital Twin, AI and machine learning algorithm, crystal plasticity model, Ag and Cu sintering model, probability and optimization algorithm for component and system level models