Job Purpose
- Utilize and operate FIB tool, perform analysis to support the Failure analysis on Image Sensor (IS), Integrate Circuit (IC) and discrete devices, to identify the defect site on the devices based on the failure mode
- Lab equipment setup, equipment maintenance and related specifications.
- Support day to day lab operations
onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work.
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Qualifications
- Diploma holder above in electronic, physics, materials science or mechanical engineering. Vocational certificate with min. 3 years experience will be considered.
- 2 years relevant experience preferred, fresh graduate will be considered.
- Must be proficient in English
Working Conditions
- The job requires a person to work in day/night shift and in any circumstances that work will be needed as required by specific job requests and urgency.
- Job covers laboratory-related works so handling with chemicals is common to the failure analysis procedure.
- PAL Manager
Physical Requirements
- Job covers laboratory-related works so handling with chemicals is common to the failure analysis procedure.
Direct Reports
Duties and Responsibilities
- Responsible for utilization and operation FIB tool, perform the analysis to support failure analysis, Skillful in conduct FIB application, the progressive cross section, delayer, circuit edit, STEM imaging and GIS application.
- Utilize EDA software circuit schematics& layouts to locate precise location to analysis in FIB
- Handle milling and cross section tool, perform sample preparation
- Support failure analysis electrical bench verification and characterization of failures. Performed failures from wafer fabrication or package assembly, reliability stress test failures, qualification fails, customer returns as well as new product and process introduction fails.
- Understanding of a variety of analog & logic circuits required. Knowledge of semiconductor manufacturing processes including wafer fab, assembly and test.
- Developmental aspects involve identifying and implementing advanced methods for quality improvement.
- Work with customer quality and field application engineers to solve customer problems