SWIR Vision Systems
Seremban, Negeri Sembilan, Malaysia
Job Summary:
· New Package Technology and New Platform Module Development
o Responsible for new package/technology development following Advanced Product Qualification Plan (APQP).
o Good understanding of MRS and generate PRS with SCD definition.
o Responsible for internal/external package structure with designer, materials, assembly process flow and cost structure to meet the development goal.
o Familiar with DFM, to secure robust manufacturability with quality requirements.
o Good understanding of power module package design rule, design rule update with new platform development.
o Generate deliverables upon package development procedure (DFMEA, control plan, process FMEA, LAR plan, QFD, etc.).
o Planning and execution for development activities per development phase with process development engineers (feasibility, process characterization, LAR, etc.).
o Drive problem solving methodology with risk assessment to find technical issue and provide systematic solution.
o Strong knowledge and in-depth understanding of device-package interaction.
o Effectively working with team for on time development.
· Technical Project Management and Communication
o Responsible for defining and ensuring adherence based on technical requirement, quality requirement, project timing and cost.
o Strong communication with team for technical issue and problem solving, provide the improvement timeline with RCCA definition.
o Supporting to track and remind team members for tasks, deliverables, milestones of projects, successfully work with PM to be developed on time.
o Participate in all project/gate review, alignment with team.
More details about our company benefits can be found here:
| We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work. |
Requirements:
· 8+ years in package development.
· Experienced areas: Power module package (pkg sintering / pkg soldering) development, B2S / B6S experience is plus.
· Experienced packages: Power module package (pkg sintering / pkg soldering)
· Education: BS or MS degree.
· Skills: Fluent with English communication, familiar with statistical SW (JMP, Minitab), Auto-CAD and MS-office (ppt presentation).
· Personal characteristics: self-motivated, independent, open mind to communicate, willing to take risk and managing.
onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a continued focus on the automotive and industrial end-markets, onsemi is accelerating change and driving disruptive innovation towards a sustainable ecosystem in high-growth megatrends such as vehicle electrification, advanced safety, alternative energy, and factory automation. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world. Today, the industrial and automotive end-markets are responsible for two-thirds of global greenhouse gas emissions, providing an immense opportunity for onsemi to do its part in achieving a net-zero economy with its intelligent power and sensing technologies. Climate change presents not only a risk to the environment, but also opportunities for innovative business solutions, and onsemi is committed to applying its research and design expertise and adapting its own operations to achieve net-zero emissions by 2040.