NPI Engineer (FOL & Back-end)

SWIR Vision Systems

SWIR Vision Systems

Software Engineering

Vietnam

Posted on May 22, 2026

Job Summary:

· Power module assembly process (End of Line: Mold, Trim/Form, CD/ED) Development.

· Key person responsible to align processes between R&D and Manufacturing.

· Establish process POR through set up, feasibility and characterization followed by package development procedure.



onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.

More details about our company benefits can be found here:

https://www.onsemi.com/careers/career-benefits


We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work.


Qualifications & experience

  • Degree in Mechanical, Mechatronics Engineering, Electronic, Materials or relevant educational background.
  • Minimum 5 years’ experienced in Semiconductor area

KNOWLEDGE, SKILLS AND ABILITIES

  • Proficient in written and conversational English.
  • Strong knowledge of Plating/surface treatment and material
  • Having knowledge of Transfer Molding, Trim and Form is preferred.
  • Semiconductor processes and Material knowledge on Plating, Mold Compound, wire, and solder OR a very quick learner and walk extra miles to pick up new knowledge.
  • Equipment and tooling design and hands on experience.
  • Proactive and initiative to look for solution
  • Able to work independently
  • Understand DOE and process characterization.
  • Min level 3 AutoCAD application.
  • Added advantages with SPC software applications such as JMP and statical software.
  • Understand solid state of semiconductor, especially on integrated circuit design and application.sk.

onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a continued focus on the automotive and industrial end-markets, onsemi is accelerating change and driving disruptive innovation towards a sustainable ecosystem in high-growth megatrends such as vehicle electrification, advanced safety, alternative energy, and factory automation. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world. Today, the industrial and automotive end-markets are responsible for two-thirds of global greenhouse gas emissions, providing an immense opportunity for onsemi to do its part in achieving a net-zero economy with its intelligent power and sensing technologies. Climate change presents not only a risk to the environment, but also opportunities for innovative business solutions, and onsemi is committed to applying its research and design expertise and adapting its own operations to achieve net-zero emissions by 2040.



Responsibilities

  • Involve in tooling design, new material exploration, new generation die technology characterization and new technology of assembly for semiconductor industry
  • Troubleshooting the issue during development stage with analytical and technical skill
  • Exploring new technology in the market and competitor movement.
  • Develop process flow for new package development in semiconductor