Process Integration Engineer (PI)
Bucheon-si, Gyeonggi-do, South Korea
Posted on Jul 16, 2026
onsemi is seeking Process Integration engineer (PI) for wide bandgap technology ramp to drive fast ramp of new technologies without quality issue in manufacturing factories for wide band gap technologies. This engineer will need to work with unit process development team, device team, package development, product engineering from fab tool selection, module unit process development, process integration flow, to enable new technologies and new products meeting customer requirement, manufacturability, high quality, and fast time to market delivery.
This is “hands on” position. The successful candidates are expected to be able to work independently as well as within teams. They should possess analytical skills to identify problems, the leadership skills to own and drive improvement across all aspects of new technology from feasibility to production ramp.
onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
More details about our company benefits can be found here:
| We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work. |
Qualification
- Bachelor’s degree. An advanced degree is preferred in semiconductor processing, device physics or compatible disciplines.
- 0-5 years of experience in semiconductor engineering related field in process integration.
- Ability to manage technology development planning and project schedules effectively.
- Deep understanding of semiconductor device physics and microelectronics.
- Knowledge of failure analysis techniques.
- Experience in working and leading cross functional teams and remote factories.
- Ability to drive changes.
- Bucheon, Korea as a main work site.
Responsibilities
- Lead SiC process integration in technology development/transfer and qualifications for empowering onsemi’s SiC technology leadership.
- Design/execute/analyze experiments to improve performance and yield for current and next generation technology to meet the requirement.
- Manage process design/route, engineering run plan and their controls for delivering new technology/product development in timely manner.
- Analyze big data to identify weaknesses in process flow or root-cause of issues during fab process, and to drive process more robust and reliable.
- Collaborate closely with the process engineering teams to develop new processes and to maintain sustainability.
- Create new test structures and test methodologies to monitor key performance/process parameters for continuous improvement in process and device.
- Understand the technology/product performance margins and process corner and set design rules and process control limits.