ENGR I, MANUFACTURING EQUIP; MFG
Seremban, Negeri Sembilan, Malaysia
Posted on Jul 18, 2026
Responsible for supporting Assembly manufacturing equipment, driving equipment reliability and leading New Product Introduction (NPI) activities for new package and product development.
onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
More details about our company benefits can be found here:
| We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work. |
• Bachelor Degree in Engineering.
• 3–5 years semiconductor assembly experience.
• Experience with Die Attach, Wire Bond, Sintering, Molding, Singulation or related equipment.
• Familiar with SPC, FMEA, 8D and DOE methodologies.
• Strong analytical and communication skills.
• Support assembly equipment uptime, OEE and maintenance programs.
• Lead equipment qualification and readiness for NPI programs.
• Coordinate with Process, Product, Quality and Manufacturing teams.
• Develop machine recipes, tooling and process parameters.
• Support DOE, process characterization and improvement projects.
• Drive yield, cycle time and productivity improvements.
• Maintain engineering documentation and compliance requirements.