Package Development Engineer
Marketing & Communications, Product · Full-time
Munich, Germany · Scottsdale, AZ, USA
Posted on Sep 16, 2026
Lead the development and commercialization of advanced embedded packaging technologies incorporating embedded passives, active devices, and high-density substrate integration. Drive package architecture, material selection, process development, reliability qualification, and manufacturing readiness while collaborating with internal and external partners throughout the product development lifecycle.
onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
More details about our company benefits can be found here:
We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work.
onsemi is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, ethnicity, color, religion, ancestry, national origin, age, marital status, pregnancy, sex, sexual orientation, physical or mental disability, medical condition, genetic information, military or veteran status, gender identity, gender expression, or any other protected category under applicable federal, state, or local laws.
If you are an individual with a disability and require a reasonable accommodation to complete any part of the application process, or are limited in the ability or unable to access or use this online application process and need an alternative method for applying, you may contact Talent.acquisition@onsemi.com for assistance.
- BS/MS in Electrical, Mechanical, Materials, Chemical Engineering, or related field.
- 8+ years of semiconductor package development experience.
- Proven expertise in embedded packaging, substrate technologies, and advanced interconnects.
- Strong knowledge of package reliability, failure analysis, and manufacturing processes.
- Experience with DOE, statistical analysis, and process optimization.
- Experience working with OSATs, substrate suppliers, and material vendors.
- Strong communication skills, with the ability to effectively collaborate with Business Units, cross-functional teams, internal and external manufacturing partners, and customers.
- Proficiency in engineering tools and methodologies, including ACAD, 8D, SPC, DFMEA, DOE.
- Proven ability to lead projects across organizations and cultures in a fast-paced environment.
- Develop embedded package architectures with embedded passives, active devices, and HDI substrates.
- Define substrate stack-ups, interconnect schemes, thermal solutions, and package design rules.
- Lead process development for embedding, lamination, laser drilling, metallization, and assembly.
- Drive package qualification and reliability assessments in accordance with JEDEC, IPC, and customer requirements.
- Partner with OSATs, substrate suppliers, and material vendors to establish scalable manufacturing solutions.
- Conduct root cause analysis and implement yield, quality, and cost improvements.
- Lead cross-functional teams through concept, development, qualification, and production release.