- Find/Create linkages with POC labs/providers (Eqpt, Material, Service providers)
- New package development -from conceptualization and ideation to creation of fully functional prototypes
- Physically conduct POC builds and/or technology demonstration with Provider
- Benchmark processes/technologies
- Provides POC development costing and project timing
- Follows the New Package Technology Development (12MON47078H) and H3 Ideation Flow
- Make sure we are covered with the Intellectual Property prior engagement
- Generate/Present POC and/or Technology demonstration reports to Stakeholders
- Technology Transfer to development site
- Provides intelligence on Package Technology/Market
- Responsible for New Package Development. Conducts tests and research on basic materials and properties involved in packaging. Develops solutions.
- Provides recommendations regarding technical approach or design, resource allocation, or project timing.
- Works with general guidance but independently determines the best approach for solving a problem.
- Conducts Design reviews and risk assessments with participation by other technical experts
- Manages the Technical risks of the projects assigned to ensure deployment of mitigation actions as per committed project timing
- Strong interaction with Manufacturing, Reliability and Business Units to close engineering gaps and for smooth production transfer.
onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work.
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- Bachelors/Master of appropriate technical discipline; ie. Physics, Electrical Engineering, Chemical Engineering, Materials Science, Mechanical Engineering, Electronics and Communications Engineering
- 8 years of experience in semiconductor manufacturing, particularly in New Package/Product Development
- Hands-on assembly development and manufacturing experience.
- Analytical skills: process, materials and assembly equipment parameters
- Hands-on experience on program management